laser jetting solder sphere machine for pcb board and gold fingers
width* peak value
depends the product
solder pat size
solder pat pitch: >0.3 mm,
solder pat size:
tin wire or solder paste: 0.8 mm~5mm
tin ball method: 0.4mm ~ 1mm
rectangular pad: if required to be covered, aspect ratio <5:1
at present, various common soldering materials on the market are suitable.
tin wire minimum diameter: 0.5mm
tin ball minimum diameter: 0.3mm
within 2mm of the solder joint, it is not practical to use non-metallic materials, otherwise it is easy to scatter laser burns.
positioning deviation: <0.1 mm, if the deviation is large, it can be calibrated with visual positioning.
if tin wire soldering is used, space is required for the tin wire.
if the two products are stacked, the gap between the two products is <0.1mm
tin ball drop welding is used.
pad surface requires gold or tin plating
due to the current infrared non-contact temperature, the adaptability is poor, and it is easy to be affected by various factors such as surface material, flux smoke and product reflection angle. it is not recommended to do temperature feedback. otherwise, the actual effect may be counterproductive.
it is recommended to collect and display the temperature if needed, but only as a reference for the welding process.